This course details various electronic, photonic, electro-optical and micro-electro-mechanical components, which require deepening in technological aspects in order to make them part of the electronic systems, thus achieving an added value.
The latest technologies, new materials and new structures are included, so that they can be used in the designs and specifications of complex electronic subsystems.
- Power electronic devices and components of specific use; for example those based on Wide Bandgap technologies such as silicon carbide (SiC) and gallium nitride (GaN) for high voltage, high current and high power.
- High frequency active components such as MESFETs, HEMTs, HBTs, and their application circuits.
- Passive and active photonic devices and components; for example, fiber Bragg gratings, quantum cascade lasers, optical modulators (Mach-Zehnder, electroabsorption), optical amplifiers and demultiplexers based on optical ring resonators.
- Devices based on liquid crystals and micro-electro-mechanical devices (MEMS), their properties and application environments; for example, capacitive sensors, bioengineering, SAW filters, spatial light modulators SLM and chromatic filters.
This course provides each student with the ability to integrate the latest electronic, micro-electro-mechanical, photonic and electro-optical components available on the market that are part of high value-added electronic systems.